CHINA’S FUTURE-FORWARD PACKAGING INNOVATIONS

Would you like a feature on how China is innovating in the global packaging market? Driven by the massive demand for AI chips, advanced packaging is in short supply, and the development of major advanced packaging technologies is booming, such as the fan-out panel level packaging (FOPLP), which is a promising semiconductor technology that has been attracting investments from Taiwan’s supply chains, and the small outline integrated circuit (SOIC), which is a surface-mounted integrated circuit package which occupies less area. Meanwhile, two major billion-dollar projects in China have made recent progress, with HT-Tech’s Nanjing Integrated Circuit Advanced Packaging and Testing Industrial Base project, which aims to build 200,000 square meters of factories and supporting facilities, introduce high-end production equipment, and create an internationally advanced integrated circuit packaging and testing production line, entering its second phase. Also, Tongfu’s advanced packaging base is making significant strides. It focuses on communications, memory, computing power, and other application areas, with an emphasis on multi-layer stacking, flip-chip, wafer-level, and panel-level packaging. Our local correspondent can get the details.